The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

May. 23, 2013
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Emmanuel P. Quevy, El Cerrito, CA (US);

David H. Bernstein, Berkeley, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H03H 3/007 (2006.01); H03H 9/24 (2006.01); G02B 6/35 (2006.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0069 (2013.01); B81C 1/00349 (2013.01); B81C 1/00523 (2013.01); H03H 3/0076 (2013.01); H03H 9/2405 (2013.01); H03H 9/2457 (2013.01); G02B 6/358 (2013.01); H03H 2009/02496 (2013.01); H03H 2009/2442 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/49165 (2015.01);
Abstract

Methods of forming MEMS resonators containing a first structural material and a second structural material to tailor the resonator's temperature coefficient of frequency (TCF). The first structural material has a different Young's modulus temperature coefficient than the second structural material. In one embodiment, the first structural material may be formed on substrate and patterned, and the second structural material may be formed over the first structural material and planarized to expose the first structural material. A resonator may be patterned that contains both the first and second structural materials.


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