The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Nov. 04, 2014
Applicant:
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Inventors:
Emmanuel P. Quevy, El Cerrito, CA (US);
Louis Nervegna, Andover, MA (US);
Jeremy R. Hui, San Jose, CA (US);
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01N 27/22 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 7/008 (2013.01); B81B 7/0077 (2013.01); B81C 1/0038 (2013.01); B81C 1/00158 (2013.01); B81C 1/00246 (2013.01); B81C 1/00285 (2013.01); B81C 1/00333 (2013.01); G01N 27/223 (2013.01); B81B 2201/0214 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81C 2203/0136 (2013.01); B81C 2203/0172 (2013.01); B81C 2203/0735 (2013.01);
Abstract
Trapped sacrificial structures and thin-film encapsulation methods that may be implemented to manufacture trapped sacrificial structures such as relative humidity sensor structures, and spacer structures that protect adjacent semiconductor structures extending above a semiconductor die substrate from being contacted by a molding tool or other semiconductor processing tool in an area of a die substrate adjacent the spacer structures.