The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
May. 07, 2015
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Junji Tatsumi, Kawasaki, JP;
Genji Inada, Koshigaya, JP;
Sayaka Seki, Tokyo, JP;
Yuichiro Akama, Tokyo, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B32B 38/00 (2006.01); B32B 37/18 (2006.01); B32B 37/12 (2006.01); B32B 27/06 (2006.01); B29C 65/52 (2006.01); B32B 9/00 (2006.01); B32B 3/06 (2006.01); F16B 11/00 (2006.01); B29K 701/00 (2006.01); B29K 707/00 (2006.01); B29K 709/02 (2006.01); B29L 31/00 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B29C 65/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/16 (2013.01); B29C 65/524 (2013.01); B32B 3/06 (2013.01); B32B 9/00 (2013.01); B32B 9/005 (2013.01); B32B 27/06 (2013.01); B32B 37/1292 (2013.01); B32B 37/18 (2013.01); B32B 38/0004 (2013.01); B41J 2/14 (2013.01); B41J 2/1433 (2013.01); B41J 2/162 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); F16B 11/00 (2013.01); B29C 65/1406 (2013.01); B29C 65/4835 (2013.01); B29C 65/4845 (2013.01); B29C 66/1122 (2013.01); B29C 66/54 (2013.01); B29C 66/71 (2013.01); B29C 66/73112 (2013.01); B29C 66/7461 (2013.01); B29K 2701/00 (2013.01); B29K 2707/00 (2013.01); B29K 2709/02 (2013.01); B29L 2031/767 (2013.01); B32B 2037/1253 (2013.01); B32B 2250/02 (2013.01); B32B 2313/00 (2013.01); B32B 2315/02 (2013.01); Y10T 156/1064 (2015.01);
Abstract
A liquid ejection head includes a recording element substrate that ejects liquid, and an element-substrate support member to which the recording element substrate is bonded with an adhesive. A groove to be filled with the adhesive is provided in a bonding region of the element-substrate support member, at which the element-substrate support member and the recording element substrate are bonded together, along a part or an entirety of the outer circumference of the recording element substrate.