The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Jun. 07, 2012
Seh Kwang Lee, Yongin-si, KR;
Youn Chul Kim, Hwaseong-si, KR;
Joo Han Lee, Seongnam-si, KR;
Jae Kwang Choi, Suwon-si, KR;
Jae Phil Boo, Seongnam-si, KR;
Seh Kwang Lee, Yongin-si, KR;
Youn Chul Kim, Hwaseong-si, KR;
Joo Han Lee, Seongnam-si, KR;
Jae Kwang Choi, Suwon-si, KR;
Jae Phil Boo, Seongnam-si, KR;
EHWA DIAMOND INDUSTRIAL CO., LTD., Gyeonggi-Do, KR;
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Abstract
Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.