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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9421645 B1

PDFFull Text
Expired
Date of Patent:
Aug. 23, 2016

Filed:

Sep. 25, 2014

Solder joint material and method of manufacturing the same

Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Yuichi Oda, Ibaraki, JP;

Hideyuki Sagawa, Naka-gun, JP;

Kazuma Kuroki, Hitachinaka, JP;

Hiromitsu Kuroda, Hitachi, JP;

Kotaro Tanaka, Naka-gun, JP;

Hiroaki Numata, Hitachi, JP;

Assignee:

Hitachi Metals, Ltd., Tokyo, JP;

Attorney:

Roberts Mlotkowski Safran Cole & Calderon

Primary Examiner:

Daniel J Schleis

Int. Cl.
CPC ...
B32B 15/00 (2006.01); B23K 35/00 (2006.01); B23K 1/20 (2006.01); B23K 35/28 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); B32B 15/01 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01);
U.S. Cl.
CPC ...
B23K 35/002 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 35/00 (2013.01); B23K 35/007 (2013.01); B23K 35/0222 (2013.01); B23K 35/0227 (2013.01); B23K 35/0238 (2013.01); B23K 35/28 (2013.01); B23K 35/282 (2013.01); B23K 35/286 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); B32B 15/017 (2013.01); C25D 5/50 (2013.01); B23K 2201/42 (2013.01); B32B 2307/702 (2013.01); C25D 7/0607 (2013.01); C25D 7/0614 (2013.01); Y10T 428/1266 (2015.01);
Abstract

A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.

Find Patent Forward Citations

Oda, Yuichi. (2016). Solder joint material and method of manufacturing the same (U.S. Patent No. 9421645). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9421645

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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