The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Oct. 23, 2006
Yuichi Furukawa, Toyota, JP;
Toshio Uchida, Kasugai, JP;
Setsuyu Hayakawa, Nagoya, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Abstract
An object is to propose a mold release agent improving the state of a mold surface by repeating casting cycle so as to extend the life of the metal mold actively, and a casting method using the mold release agent. A water-soluble mold release agent applied on a mold surface of a metal mold contains organic acid or organic acid salt which is reducing and ligand, wherein concentration of a total thereof is not less than 0.01 wt % in using concentration and is not more than a fixed concentration which is stability limit of emulsion of the mold release agent in undiluted concentration. Construction weight ratio of the organic acid or organic acid salt which is reducing and the ligand is in the range from 99/1 to 30/70. The mold release agent is applied on a mold surface of a die casting metal mold, molten metal is injected into the metal mold, and the organic acid or organic acid salt which is reducing in the mold release agent is reacted with a component of the mold surface so as to deoxidize FeOon the mold surface to FeO.