The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Feb. 03, 2014
Applicant:

Biomet Manufacturing, Llc, Warsaw, IN (US);

Inventors:

David W. Schroeder, Winona Lake, IN (US);

Jordan H. Freedman, Fort Wayne, IN (US);

Assignee:

Biomet Manufacturing, LLC, Warsaw, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/15 (2006.01); A61F 2/34 (2006.01); A61L 27/16 (2006.01); B29C 71/02 (2006.01); B29C 71/04 (2006.01); B23P 15/00 (2006.01); A61F 2/32 (2006.01); A61F 2/38 (2006.01); B29C 35/08 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
A61F 2/34 (2013.01); A61F 2/389 (2013.01); A61L 27/16 (2013.01); B23P 15/003 (2013.01); B29C 71/02 (2013.01); B29C 71/04 (2013.01); A61F 2/32 (2013.01); A61F 2/38 (2013.01); B29C 2035/085 (2013.01); B29C 2071/022 (2013.01); B29L 2031/7532 (2013.01);
Abstract

Methods provide a non-eluting antioxidant doped UHMWPE in the form of an implant bearing component. The process includes the steps of: (a) providing a preform; (b) irradiating the preform with γ-irradiation to crosslink the UHMWPE; (c) doping the crosslinked preform by exposing it to an antioxidant composition at a temperature below the melting point of the UHMWPE; (d) removing the doped material from contact with the antioxidant composition; and then (e) annealing by heating the doped material at a temperature above 30° C. and below the melting point of the UHMWPE; followed by (f) making an implant bearing component from the doped material, wherein at least 1 mm but no more than about 15 mm of material are removed to make the component.


Find Patent Forward Citations

Loading…