The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9419202 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 16, 2016

Filed:

Jun. 21, 2013
Applicant:

General Electric Company, Schenectady, NY (US);

Inventor:

Alan Chi-Chung Tai, Phoenix, AZ (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/25 (2013.01); H01L 41/08 (2006.01); B06B 1/06 (2006.01); A61B 8/00 (2006.01); A61B 8/08 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0825 (2013.01); B06B 1/067 (2013.01); B06B 1/0622 (2013.01); B06B 1/0681 (2013.01); H01L 41/25 (2013.01); A61B 8/4483 (2013.01); A61B 8/483 (2013.01); Y10T 29/42 (2015.01);
Abstract

An ultrasound transducer includes an acoustic layer having a front side and an opposite back side. The acoustic layer is configured to convert electrical signals into ultrasound waves to be transmitted from the front side toward a target. The acoustic layer is configured to convert received ultrasound waves into electrical signals. A lens is connected to the front side of the acoustic layer. A heat sink is connected to the back side of the acoustic layer. A flex circuit is disposed between the acoustic layer and the heat sink. The flex circuit includes a backside matching layer incorporated into a body of the flex circuit. The backside matching layer is connected in thermal communication with the acoustic layer and the heat sink such that the backside matching layer is configured to conduct heat from the acoustic layer to the heat sink.


Find Patent Forward Citations

Tai, Alan Chi-Chung. (2016). Ultrasound transducer and method for manufacturing an ultrasound transducer (U.S. Patent No. 9419202). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9419202

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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