The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Oct. 05, 2010
Applicants:

Bernd Barchmann, Regensburg, DE;

Axel Kaltenbacher, Mintraching, DE;

Norbert Stath, Regensburg, DE;

Walter Wegleiter, Nittendorf, DE;

Karl Weidner, München, DE;

Ralph Wirth, Lappersdorf, DE;

Inventors:

Bernd Barchmann, Regensburg, DE;

Axel Kaltenbacher, Mintraching, DE;

Norbert Stath, Regensburg, DE;

Walter Wegleiter, Nittendorf, DE;

Karl Weidner, München, DE;

Ralph Wirth, Lappersdorf, DE;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 25/0753 (2013.01); H01L 2224/24998 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12042 (2013.01);
Abstract

An opto-electronic component has a carrier element () with a connection region (). Arranged on the carrier element () is a semiconductor chip (). A contact region () is mounted on the surface () of the semiconductor chip () remote from the carrier element (). The connection region () is electrically conductively connected to the contact region () by way of an unsupported conductive structure (). A method for manufacturing an opto-electronic component is described.


Find Patent Forward Citations

Loading…