The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9419116 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 16, 2016

Filed:

Oct. 21, 2015
Applicant:

Alexei Ankoudinov, Redmond, WA (US);

Inventor:

Alexei Ankoudinov, Redmond, WA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/872 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/861 (2006.01); H01L 29/32 (2006.01); H01L 29/40 (2006.01); H01L 29/16 (2006.01); H01L 21/263 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7391 (2013.01); H01L 21/263 (2013.01); H01L 29/0619 (2013.01); H01L 29/32 (2013.01); H01L 29/66136 (2013.01); H01L 29/66143 (2013.01); H01L 29/861 (2013.01); H01L 29/8611 (2013.01); H01L 29/872 (2013.01); H01L 29/1608 (2013.01); H01L 29/407 (2013.01); H01L 29/8725 (2013.01);
Abstract

Diodes and methods of manufacturing diodes are disclosed. In some examples, the diodes may include a cathode assembly. The cathode assembly may include a cathode electrode and a N+ substrate layer on the cathode electrode. The cathode assembly may additionally include a N buffer layer on the N+ substrate layer, and a N− bulk layer on the N buffer layer. The N buffer layer may be disposed between the N+ substrate layer and the N− bulk layer. Additionally, the N buffer layer may include at least one damaged sublayer having crystal damage configured to provide recombination centers for charge carriers and at least one undamaged sublayer that excludes crystal damage. The diodes may additionally include an anode assembly adjacent to the N− bulk layer.


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