The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
May. 04, 2015
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventors:
Michael Joseph McPartlin, North Andover, MA (US);
Mark M. Doherty, Westford, MA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01Q 1/24 (2006.01); H01L 27/06 (2006.01); H01L 29/165 (2006.01); H01L 29/737 (2006.01); H01L 23/66 (2006.01); H03F 3/24 (2006.01); H01L 29/08 (2006.01); H01L 21/76 (2006.01); H01L 27/082 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0603 (2013.01); H01L 21/76 (2013.01); H01L 23/66 (2013.01); H01L 27/067 (2013.01); H01L 27/0823 (2013.01); H01L 29/0821 (2013.01); H01L 29/165 (2013.01); H01L 29/737 (2013.01); H01L 29/7378 (2013.01); H01Q 1/24 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H03F 2200/451 (2013.01);
Abstract
Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.