The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Jan. 23, 2015
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Kenta Nojima, Kumamoto, JP;
Kengo Kotoo, Kumamoto, JP;
Hirotaka Yoshioka, Kumamoto, JP;
Kenta Ikeda, Kumamoto, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14636 (2013.01);
Abstract
There is provided a solid state image pickup apparatus including a first semiconductor substrate and a second semiconductor substrate which are bonded to each other, and a buried portion formed in a peripheral portion of the apparatus with a depth of a bonded surface of the first semiconductor substrate and the second semiconductor substrate in such a manner that the bonded surface of the first semiconductor substrate and the second semiconductor substrate is not exposed.