The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Mar. 10, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Yoko Nakamura, Matsumoto, JP;

Norihiro Nashida, Kita-asumi-gun, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 29/40 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 25/072 (2013.01); H01L 29/408 (2013.01); H01L 25/18 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/11318 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92242 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device including a semiconductor chip, a first electrode pad and second electrode pad included on one surface of the semiconductor chip, a first conductive post joined by a joining material to the first electrode pad, a plurality of second conductive posts joined by a joining material to the second electrode pad, and a printed substrate, disposed opposing the one surface of the semiconductor chip, on which is formed an electrical circuit to which the first conductive post and second conductive posts are connected. The second conductive posts on the side near the first conductive post are arrayed avoiding a short-circuit prevention region at a distance such that the joining material of the first conductive post and the joining material of the second conductive posts do not link.


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