The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Nov. 12, 2014
Applicant:

SK Hynix Inc., Icheon, KR;

Inventor:

Tae Su Jang, Gwacheon, KR;

Assignee:

SK HYNIX INC., Icheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/10 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/788 (2006.01); H01L 27/105 (2006.01); G11C 7/06 (2006.01); H01L 27/108 (2006.01); H01L 21/324 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28202 (2013.01); G11C 7/06 (2013.01); H01L 21/28194 (2013.01); H01L 21/324 (2013.01); H01L 27/1052 (2013.01); H01L 27/10876 (2013.01); H01L 27/10891 (2013.01); H01L 29/4236 (2013.01); H01L 29/66621 (2013.01); H01L 29/66825 (2013.01); H01L 29/788 (2013.01);
Abstract

An embodiment of the semiconductor device includes a recess formed in an active region, a gate buried in a lower part of the recess, a first capping insulation film formed over the gate, a second capping insulation film formed over the first capping insulation film, and a third capping insulation film formed over the second capping insulation film. In the semiconductor device including the buried gate, mechanical stress caused by a nitride film can be reduced by reducing the volume of a nitride film in a capping insulation film formed over a buried gate, and the ratio of silicon to nitrogen of the nitride film is adjusted, so that mechanical stress is reduced, resulting in improvement of operation characteristics of the semiconductor device.


Find Patent Forward Citations

Loading…