The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Jul. 10, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tomoaki Sasaki, Mie, JP;

Takafumi Imai, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 51/01 (2006.01); H01H 50/20 (2006.01); H01H 50/44 (2006.01); H01H 50/54 (2006.01); H01H 50/64 (2006.01); H01F 7/16 (2006.01); H01F 7/122 (2006.01);
U.S. Cl.
CPC ...
H01H 50/20 (2013.01); H01H 50/443 (2013.01); H01H 50/54 (2013.01); H01H 50/64 (2013.01); H01H 51/01 (2013.01); H01F 7/122 (2013.01); H01F 7/1615 (2013.01); H01F 7/1623 (2013.01); H01H 2050/446 (2013.01); H01H 2201/00 (2013.01);
Abstract

A relay includes a fixed contact point, a movable contact member and an electromagnetic device. The electromagnetic device includes a bobbin, a coil, a movable iron core, a first armature, a second armature, and a ferromagnetic member. The first armature has a first hole to which a first end portion of the movable iron core is insertion-fitted. The second armature has a second hole to which a second end portion of the movable iron core is insertion-fitted. The bobbin has a first rib formed on each of facing surfaces of a pair of first side pieces and a second rib formed on each of facing surfaces of a pair of second side pieces. The first armature is interposed between the first ribs of the pair of first side pieces and the second armature is interposed between the second ribs of the pair of second side pieces.


Find Patent Forward Citations

Loading…