The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Mar. 29, 2012
Shunsuke Takeuchi, Echizen, JP;
Kenichi Kawasaki, Echizen, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Shuji Matsumoto, Omihachiman, JP;
Seiichi Nishihara, Kameoka, JP;
Shunsuke Takeuchi, Echizen, JP;
Kenichi Kawasaki, Echizen, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Shuji Matsumoto, Omihachiman, JP;
Seiichi Nishihara, Kameoka, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.