The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Aug. 08, 2013
Applicant:

Mxtran Inc., Hsin Chu, TW;

Inventors:

Huan-Chin Luo, Hsinchu County, TW;

Wan-Sheng Ni, Taipei, TW;

Chih-Hong Tsai, New Taipei, TW;

Chin-Sheng Lin, Zhubei, TW;

Assignee:

MXTRAN INC., Hsin Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04Q 5/22 (2006.01); G06K 7/06 (2006.01); G06K 7/10 (2006.01); G06K 19/07 (2006.01); H04B 1/3816 (2015.01); H04B 1/401 (2015.01);
U.S. Cl.
CPC ...
G06K 7/065 (2013.01); G06K 7/10237 (2013.01); G06K 7/10247 (2013.01); G06K 7/10297 (2013.01); G06K 7/10336 (2013.01); G06K 19/0727 (2013.01); H04B 1/3816 (2013.01); H04B 1/401 (2013.01);
Abstract

An integrated circuit film comprising a circuit board and a control circuit is provided. The circuit board has an IC-installation part and a contact part and having a first surface and a second surface opposite to the first surface. The contact part comprises a first set of pads and a second set of pads. The first set of pads are located on the first surface for communicating with an electrical communication device. The second set of pads are located on the second surface for communicating with a smart card. The control circuit is mounted on the IC-installation part for communicating with the electrical communication device through one of the first set of pads configured in accordance with a single wire protocol (SWP), a communication protocol.


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