The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Jan. 05, 2015
Honda Motor Co., Ltd., Tokyo, JP;
Shigeto Akahori, Tochigi, JP;
Hitoshi Saito, Tochigi, JP;
Hiroyuki Yamagishi, Tochigi, JP;
Shinyu Hirayama, Tochigi, JP;
Satoshi Hasegawa, Tochigi, JP;
Yoko Yamaji, Tochigi, JP;
Koichiro Sato, Tochigi, JP;
Machie Saitou, Tochigi, JP;
HONDA MOTOR CO., LTD., Tokyo, JP;
Abstract
Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.