The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Feb. 20, 2014
Kobe Steel, Ltd., Kobe-shi, JP;
Yosuke Miwa, Shimonoseki, JP;
Yasushi Masago, Shimonoseki, JP;
Masayasu Nishimura, Shimonoseki, JP;
Hideki Matsushita, Shimonoseki, JP;
Kobe Steel, Ltd., Kobe-shi, JP;
Abstract
Provided is a lead frame made of a Cu—Fe-based copper alloy strip to improve the heat dissipation in an LED package. An Ag plating reflective film formed on the lead frame enhances the brightness of the LED package. In the Cu—Fe-based copper alloy strip, arithmetic mean roughness Ra is 0.2 μm or less, ten-point mean roughness Rzis 1.2 μm or less, and maximum height roughness Rz is 1.5 μm or less and depressions having an average length in a rolling parallel direction of 2 to 100 μm, an average length in the rolling vertical direction of 1-30 μm, and a maximum depth along the rolling parallel direction of 400 nm or less. The Cu—Fe-based copper alloy strip contains 1.8-2.6 mass % of Fe, 0.005-0.20 mass % of P, and 0.01-0.50 mass % of Zn or contains 0.01-0.5 mass % of Fe, 0.01-0.20 mass % of P, 0.01-1.0 mass % of Zn, and 0.01-0.15 mass % of Sn.