The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Oct. 04, 2010
Applicants:
Atsushi Nohara, Toyohashi, JP;
Manabu Kaneko, Toyohashi, JP;
Noriya Hayashi, Minato-ku, JP;
Inventors:
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/28 (2006.01); C08L 63/00 (2006.01); C08G 59/22 (2006.01);
U.S. Cl.
CPC ...
C08G 59/226 (2013.01); C08L 63/00 (2013.01);
Abstract
Provided is an RTM moldable chain curing resin composition which can be molded with less energy in a short time, and which makes it possible to obtain a cured product that is superior in mechanical strength. A chain curing resin composition of the present invention includes an alicyclic epoxy compound (A) having two cyclohexene oxides in a molecule and a specific modified bisphenol A-type epoxy resin (B), and the content of the alicyclic epoxy compound (A) is 25 to 90% by mass, when the total of the component (A) and the component (B) is taken as 100% by mass.