The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Oct. 15, 2013
Applicants:

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Liyuan Jiang, Beijing, CN;

Yaokun Zheng, Beijing, CN;

Lianjie Qu, Beijing, CN;

Yajie Wang, Beijing, CN;

Yanqi Jiang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/02 (2006.01); B23K 26/36 (2014.01); C03C 15/00 (2006.01); B26F 3/00 (2006.01); C03B 33/07 (2006.01); B23K 26/40 (2014.01); C03B 33/04 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B26F 3/002 (2013.01); C03B 33/074 (2013.01); C03C 15/00 (2013.01); B23K 2203/50 (2015.10); C03B 33/04 (2013.01); Y10T 29/49996 (2015.01); Y10T 225/12 (2015.04);
Abstract

A method for cutting a substrate of irregular pattern includes: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.


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