The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Dec. 18, 2014
Applicant:
Drexel University, Philadelphia, PA (US);
Inventors:
Michel W. Barsoum, Moorestown, NJ (US);
Yury Gogotsi, Warminster, PA (US);
Michael Naguib Abdelmalak, Knoxville, TN (US);
Olha Mashtalir, Philadelphia, PA (US);
Assignee:
Drexel University, Philadelphia, PA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/1393 (2010.01); H01M 4/1395 (2010.01); C01B 21/076 (2006.01); C01B 31/30 (2006.01); C01B 21/082 (2006.01); H01M 4/36 (2006.01); H01M 4/04 (2006.01); H01M 4/583 (2010.01); C01B 21/06 (2006.01); H01M 4/58 (2010.01); H01M 4/62 (2006.01); B32B 18/00 (2006.01); H01B 1/20 (2006.01); H01M 4/38 (2006.01); H01M 4/587 (2010.01); H01M 10/052 (2010.01); H01M 10/054 (2010.01); B82Y 40/00 (2011.01); H01M 10/0525 (2010.01); H01M 4/02 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B32B 18/00 (2013.01); C01B 21/06 (2013.01); C01B 21/062 (2013.01); C01B 21/0602 (2013.01); C01B 21/0615 (2013.01); C01B 21/0617 (2013.01); C01B 21/076 (2013.01); C01B 21/0828 (2013.01); C01B 31/30 (2013.01); C01B 31/303 (2013.01); C01B 31/305 (2013.01); H01B 1/20 (2013.01); H01M 4/0492 (2013.01); H01M 4/366 (2013.01); H01M 4/38 (2013.01); H01M 4/58 (2013.01); H01M 4/583 (2013.01); H01M 4/587 (2013.01); H01M 4/62 (2013.01); H01M 10/052 (2013.01); H01M 10/054 (2013.01); B32B 2250/02 (2013.01); B32B 2307/202 (2013.01); B32B 2457/10 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01P 2002/01 (2013.01); C01P 2002/08 (2013.01); C01P 2002/20 (2013.01); C01P 2002/72 (2013.01); C01P 2002/77 (2013.01); C01P 2002/78 (2013.01); C01P 2002/82 (2013.01); C01P 2002/85 (2013.01); C01P 2002/88 (2013.01); C01P 2004/03 (2013.01); C01P 2004/04 (2013.01); C01P 2004/133 (2013.01); C01P 2004/136 (2013.01); C01P 2004/24 (2013.01); C01P 2004/61 (2013.01); C01P 2006/12 (2013.01); H01M 10/0525 (2013.01); H01M 2004/021 (2013.01); Y10S 977/755 (2013.01); Y10S 977/896 (2013.01);
Abstract
The present invention is directed to compositions comprising free standing and stacked assemblies of two dimensional crystalline solids, useful for physical and electrochemical applications.