The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Aug. 03, 2015
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Cynthia L. Cain, Flemington, NJ (US);
Charles W. Paul, Madison, NJ (US);
Maria Cristina Barbosa DeJesus, Basking Ridge, NJ (US);
Assignee:
HENKEL IP HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); C08L 53/00 (2006.01); B32B 27/30 (2006.01); B29C 33/12 (2006.01); B29C 45/00 (2006.01); B29K 33/04 (2006.01); B29L 31/34 (2006.01); B29K 33/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14 (2013.01); B29C 33/12 (2013.01); B29C 45/0001 (2013.01); B29C 45/14065 (2013.01); B29C 45/14639 (2013.01); B32B 27/308 (2013.01); C08L 53/00 (2013.01); B29K 2033/04 (2013.01); B29K 2033/08 (2013.01); B29K 2033/12 (2013.01); B29L 2031/34 (2013.01); Y10T 428/23 (2015.01);
Abstract
The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.