The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Dec. 18, 2014
Applicant:

Oracle International Corporation, Redwood City, CA (US);

Inventors:

Ricki Dee Williams, Temecula, CA (US);

Ray Ping-kwan Chan, Cupertino, CA (US);

Assignee:

Oracle International Corporation, Redwood City, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/32 (2013.01); H05K 3/42 (2013.01); H05K 2201/093 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10545 (2013.01);
Abstract

Implementations of the present disclosure involve an apparatus and/or method for a large array of AC coupling/DC blocking capacitors on a printed circuit board (PCB) of a microelectronic circuit. The method provides for the placement of the blocking capacitors (and associated vias) to be placed on/through the PCB in a small area while yielding low crosstalk or interference between the vias. In one particular embodiment, the blocking capacitors are placed on the PCB in an alternating pattern, with a pair of blocking capacitors placed on the top side of the PCB followed by a pair of blocking capacitors on the bottom side of the PCB, and so on. Further, top side capacitor vias may be back-drilled from the bottom side and bottom side capacitor vias may be back-drilled from the top side.


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