The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Jul. 28, 2014
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Hidekazu Otomaru, Kyoto, JP;

Takashi Kimura, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H01L 23/15 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H01L 23/15 (2013.01); H01L 23/498 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); H05K 1/097 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/4007 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H05K 1/113 (2013.01); H05K 3/34 (2013.01); H05K 3/4015 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10318 (2013.01); H05K 2203/121 (2013.01);
Abstract

A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion of the connection pad is composed of platinum, and at least an exposed surface part of the first portion of the connection pad is composed of platinum containing a ceramic component.


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