The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Mar. 30, 2015
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Jun-Hui Yu, Shenzhen, CN;
Shin-Wen Chen, New Taipei, TW;
Shu-Sheng Peng, Shenzhen, CN;
Yong Li, Shenzhen, CN;
Dai-Peng Zhu, Shenzhen, CN;
HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Shenzhen, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
A camera module includes a circuit board, an image sensor, a bracket, a VCM, and a lens module. The image sensor is positioned on the circuit board. The bracket is mounted on the circuit board and receives the image sensor. The VCM is mounted on the bracket and includes a conductive housing and pins extending from the housing. The pins are electrically connected to the circuit board. The lens module is received in the VCM. The VCM with the lens module is supported on the bracket. The optical axis of the lens module is coinciding with a center of the image sensor. The bracket includes a plating layer and solder bumps. The plating layer is formed at least one of side surfaces of the bracket. The solder bumps electrically connect the plating layer to the circuit board and electrically connect the plating layer to the housing.