The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Mar. 21, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Hisanori Murase, Nagaokakyo, JP;

Masashi Hayakawa, Nagaokakyo, JP;

Takanori Uejima, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/44 (2006.01); H04B 1/00 (2006.01); H03H 7/46 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
H04B 1/44 (2013.01); H04B 1/006 (2013.01); H04B 1/0064 (2013.01); H03H 7/466 (2013.01); H03H 9/725 (2013.01);
Abstract

A high-frequency module includes a first switch element and a second switch element that are mounted on a multilayer body. The first switch element includes a common terminal and individual terminals. The second switch element includes a common terminal and individual terminals. The individual terminals are connected to any of SAW filters mounted on the multilayer body or low loss filters provided inside the multilayer body. The individual terminals are grounded by being connected to an inner layer ground electrode inside the multilayer body by conductive via holes.


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