The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Apr. 26, 2013
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Michael Erhart, Hart bei Graz, AT;

Uwe Geidl, Grartkorn, AT;

Martin Hafellner, Mürzhofen, AT;

Thomas Korherr, Hartberg, AT;

Assignee:

Samsung SDI Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 11/00 (2006.01); H01R 11/28 (2006.01); G01R 31/36 (2006.01); H01M 10/42 (2006.01); H01M 10/48 (2006.01); H01R 13/62 (2006.01); H01R 43/02 (2006.01); H01M 2/20 (2006.01); H01R 4/62 (2006.01);
U.S. Cl.
CPC ...
H01R 11/281 (2013.01); G01R 31/3696 (2013.01); H01M 2/202 (2013.01); H01M 10/425 (2013.01); H01M 10/48 (2013.01); H01M 10/482 (2013.01); H01R 11/288 (2013.01); H01R 13/62 (2013.01); H01R 43/02 (2013.01); H01M 2010/4271 (2013.01); H01R 4/625 (2013.01);
Abstract

A voltage tap element configured to tap off the voltage of a battery cell of a battery unit by an electronics unit, a cell supervisory unit having such voltage tap elements, and a battery unit having such a cell supervisory unit, and methods for producing the cell supervisory unit and the battery unit. The voltage tap element is designed as a clip composed of a first metal, with a first end of the clip having a first contact region which establishes a operative connection to the electronics unit, and a second end of the clip having a second contact region for establishing a connection to the battery cell. In the first contact region, the clip is permanently connected to an intermediate piece which is composed of a second metal which differs from the first metal. The intermediate piece is configured for operative connection to the electronics unit by a solder connection using SMD technology.


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