The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Oct. 30, 2014
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Kuang-Jung Chen, Hsinchu County, TW;
Cheng-Chung Lee, Hsinchu, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5237 (2013.01); H01L 51/0097 (2013.01); H01L 51/448 (2013.01); H01L 51/524 (2013.01); H01L 2251/5338 (2013.01); Y02E 10/549 (2013.01);
Abstract
A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region.