The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Nov. 25, 2015
Applicant:

Playnitride Inc., Tainan, TW;

Inventors:

Ching-Liang Lin, Tainan, TW;

Yu-Hung Lai, Tainan, TW;

Tzu-Yang Lin, Tainan, TW;

Pei-Hsin Chen, Tainan, TW;

Assignee:

Playnitride, Inc., Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 24/95 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a temporary substrate and light-emitting elements; disconnecting the light-emitting elements from the temporary substrate to allow the light-emitting elements to float on a fluid; adjusting spacings between the light-emitting elements to have a predetermined size by controlling flow of the fluid; placing a package substrate into the fluid, followed by aligning the light-emitting elements with connecting pads of the package substrate so as to correspondingly place the light-emitting elements on the connecting pads; and removing the package substrate with the light-emitting elements from the fluid.


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