The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Jul. 07, 2014
Applicant:

SK Hynix Inc., Icheon, KR;

Inventors:

Tae Ho Lee, Cheongju, KR;

Il Hwan Cho, Icheon, KR;

In Chul Hwang, Seoul, KR;

Ga Hyun No, Cheongju, KR;

Assignee:

SK HYNIX INC., Icheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3107 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 23/49827 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A package substrate includes a substrate body and a plurality of patterns disposed on the substrate body. The substrate body has a first region including a chip attachment region and a second region adjacent to the first region. The plurality of patterns are disposed on the substrate body in the second region. Each of the plurality of patterns extends in a first direction to have a stripe shape, and the plurality of patterns are spaced apart from each other in a second direction which is substantially perpendicular to the first direction. Related fabrication methods, electronic systems and memory cards are also provided.


Find Patent Forward Citations

Quick Actions:

Lee, Tae. (2016). Package substrates, packages including the same, methods of fabricating the packages with the package substrates, electronic systems including the packages, and memory cards including the packages (U.S. Patent No. 9412690). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9412690

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