The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Aug. 04, 2014
Applicant:
Murata Manufacturing Co., Ltd.;
Inventors:
Hidekiyo Takaoka, Nagaokakyo, JP;
Kosuke Nakano, Nagaokakyo, JP;
Yutaka Ota, Nagaokakyo, JP;
Kenichi Kawasaki, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 2/04 (2006.01); H01G 4/008 (2006.01); H01G 4/252 (2006.01);
U.S. Cl.
CPC ...
H01G 4/12 (2013.01); H01G 2/04 (2013.01); H01G 4/008 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/252 (2013.01);
Abstract
An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.