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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9410985 B1

PDFFull Text
Expired
Date of Patent:
Aug. 09, 2016

Filed:

Sep. 06, 2012

Printed circuit board and magnetic field or current sensor

Applicant:

Philippe Klein, Saint Pierre d'allevard, FR;

Inventor:

Philippe Klein, Saint Pierre d'allevard, FR;

Assignee:

Commissariat à l'énergie Atomique et aux énergies alternatives, Paris, FR;

Attorney:

Occhiuti & Rohlicek LLP

Primary Examiner:

Hoa C Nguyen

Assistant Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 17/00 (2006.01); G01R 1/04 (2006.01); G01R 33/04 (2006.01); G01R 33/05 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 7/00 (2006.01); H05K 9/00 (2006.01); H01F 5/00 (2006.01); H01F 27/30 (2006.01); H01F 27/34 (2006.01);
U.S. Cl.
CPC ...
G01R 1/04 (2013.01); G01R 33/04 (2013.01); G01R 33/045 (2013.01); G01R 33/05 (2013.01); H01F 17/0013 (2013.01); H05K 1/0201 (2013.01); H05K 1/165 (2013.01); H05K 3/4697 (2013.01); H05K 2201/086 (2013.01); Y10T 156/1064 (2015.01);
Abstract

A printed circuit has a creep suppressor and a stack of metallization layers separated by electrically insulating layers. A metallization layer arranged above the insulating layer at least partially covers a cavity formed in the latter's top face. Prepreg arranged directly on the insulating layer below the metallization layer bonds the layers together. A magnetic core is housed in the cavity leaves at least a five micrometer gap between the cavity's vertical walls and roof and the core's facing vertical and top faces. During stack assembly, the creep suppressor prevents prepreg from flowing, by creep, into the cavity until it contacts more than 20% of the core's top face.

Find Patent Forward Citations

Klein, Philippe. (2016). Printed circuit board and magnetic field or current sensor (U.S. Patent No. 9410985). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9410985

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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