The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Aug. 16, 2013
Applicant:

Albert Reid Wallace, Centennial, CO (US);

Inventor:

Albert Reid Wallace, Centennial, CO (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05D 23/13 (2006.01); G05D 23/30 (2006.01); F28F 27/00 (2006.01); F24F 5/00 (2006.01); F24F 11/00 (2006.01);
U.S. Cl.
CPC ...
F28F 27/00 (2013.01); F24F 5/0046 (2013.01); F24F 11/006 (2013.01); F24F 11/0008 (2013.01); F24F 11/0012 (2013.01); F24F 11/0015 (2013.01); Y02B 10/20 (2013.01); Y02B 10/24 (2013.01);
Abstract

Controlling heating and cooling in a conditioned space utilizes a fluid circulating in a thermally conductive structure in fluid connection with a hydronic-to-air heat exchanger and a ground heat exchanger. Air is moved past the hydronic-to-air heat exchanger, the air having fresh air supply and stale air exhaust. Sensors located throughout the conditioned space send data to a controller. User input to the controller sets the desired set point temperature and humidity. Based upon the set point temperature and humidity and sensor data, the controller sends signals to various devices to manipulate the flow of the fluid and the air in order to achieve the desired set point temperature and humidity in the conditioned space. The temperature of the fluid is kept less than the dew point at the hydronic-to-air heat exchanger and the temperature of the fluid is kept greater than the dew point at the thermally conductive structure.


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