The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Oct. 30, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Gareth G. Hougham, Ossining, NY (US);

Gerard McVicker, Stormville, NY (US);

Anna Pratt, Wallkill, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/12 (2006.01); G03F 7/20 (2006.01); G03F 7/00 (2006.01); C25D 1/00 (2006.01); C25D 5/02 (2006.01); C25D 13/00 (2006.01);
U.S. Cl.
CPC ...
C25D 17/12 (2013.01); C25D 1/003 (2013.01); C25D 5/022 (2013.01); G03F 7/0037 (2013.01); G03F 7/203 (2013.01); G03F 7/2022 (2013.01); C25D 13/00 (2013.01); Y10T 428/24562 (2015.01);
Abstract

A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.


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