The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Jul. 15, 2015
Applicant:

Saint-gobain Ceramics & Plastics, Inc., Worcester, MA (US);

Inventors:

Andrew G. Haerle, Sutton, MA (US);

Jun Wang, Shrewsbury, MA (US);

Frederic Wiss, Caumont sur Durance, FR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/304 (2006.01); C09K 3/14 (2006.01); B24B 37/04 (2012.01); C01G 25/02 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1409 (2013.01); B24B 37/044 (2013.01); C01G 25/02 (2013.01); C09G 1/02 (2013.01); H01L 21/304 (2013.01); C01P 2002/52 (2013.01); C01P 2002/76 (2013.01); C01P 2004/50 (2013.01); C01P 2004/51 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C01P 2006/10 (2013.01); C01P 2006/12 (2013.01); C01P 2006/16 (2013.01); C01P 2006/22 (2013.01); C01P 2006/40 (2013.01); Y10T 428/2982 (2015.01);
Abstract

A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.


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