The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
May. 03, 2013
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jung-Hak Kim, Daejeon, KR;
You-Jin Kyung, Daejeon, KR;
Hee-Jung Kim, Daejeon, KR;
Kwang-Joo Lee, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); B29C 71/04 (2006.01); C08G 61/04 (2006.01); C08G 73/10 (2006.01); H05K 3/28 (2006.01); G03F 7/037 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
C08G 73/10 (2013.01); G03F 7/037 (2013.01); G03F 7/0387 (2013.01); G03F 7/40 (2013.01); H05K 3/287 (2013.01); H05K 2201/0154 (2013.01);
Abstract
The present invention relates to a novel polyamic acid introduced with an imidazolyl group in the polymer chain, a photosensitive resin composition including the polyamic acid and that is capable of providing a photosensitive material that satisfies the characteristics of an excellent bending property and low stiffness and also exhibits excellent heat resistance and coating resistance, a dry film obtained from the photosensitive resin composition, and a circuit board including the dry film.