The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Mar. 20, 2009
Applicants:

Casey J. Feinstein, San Jose, CA (US);

Silvio Grespan, Shanghai, CN;

Kuo-hua Sung, Cupertino, CA (US);

John Z. Zhong, Cupertino, CA (US);

Lynn Youngs, Cupertino, CA (US);

Inventors:

Casey J. Feinstein, San Jose, CA (US);

Silvio Grespan, Shanghai, CN;

Kuo-Hua Sung, Cupertino, CA (US);

John Z. Zhong, Cupertino, CA (US);

Lynn Youngs, Cupertino, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 63/00 (2006.01); B32B 43/00 (2006.01); B26D 7/10 (2006.01); B26D 1/547 (2006.01); B26D 3/28 (2006.01); G02F 1/13 (2006.01); G02F 1/1333 (2006.01); G06F 3/0354 (2013.01); B32B 7/12 (2006.01); B32B 37/16 (2006.01); B32B 38/16 (2006.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); B32B 38/00 (2006.01); B26D 7/08 (2006.01); B26D 1/00 (2006.01); B32B 37/18 (2006.01); B32B 38/04 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B23K 26/00 (2013.01); B23K 26/0054 (2013.01); B23K 26/0063 (2013.01); B23K 26/06 (2013.01); B23K 26/0604 (2013.01); B26D 1/547 (2013.01); B26D 3/28 (2013.01); B26D 7/10 (2013.01); B32B 7/12 (2013.01); B32B 37/16 (2013.01); B32B 38/0004 (2013.01); B32B 38/16 (2013.01); G02F 1/1309 (2013.01); G02F 1/13338 (2013.01); G02F 1/133308 (2013.01); G06F 3/03547 (2013.01); B26D 3/282 (2013.01); B26D 7/086 (2013.01); B26D 2001/006 (2013.01); B26D 2001/0013 (2013.01); B32B 37/12 (2013.01); B32B 37/18 (2013.01); B32B 2038/045 (2013.01); B32B 2310/022 (2013.01); B32B 2310/028 (2013.01); B32B 2310/0806 (2013.01); B32B 2310/0825 (2013.01); B32B 2310/0843 (2013.01); B32B 2310/0862 (2013.01); B32B 2457/20 (2013.01); G06F 2200/1634 (2013.01); G06F 2200/1635 (2013.01); Y10T 156/1153 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1967 (2015.01);
Abstract

Delamination of a laminated multilayer stack is provided by generating a layer-specific energy distribution in the stack during delamination. A localized energy transferrer can generate localized heating, cooling heating, cooling, or other form of energy absorption or transmission, in a bonding layer of a multilayer stack. Localized energy transfer can include thermal energy transfer, such as heating and/or cooling, acoustic energy transfer, such as applying ultrasonic energy, electromagnetic energy transfer, such as applying laser light, directed microwaves, etc. Localized energy transfer can generate a layer-specific energy distribution that can weaken the bonding layer while reducing damage to other layers of the stack.


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