The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Dec. 26, 2011
Toshikazu Sana, Kakamigahara, JP;
Akihito Sakai, Gifu, JP;
Akira Murai, Minokamo, JP;
Yasuhiro Takenaka, Anpachi-gun, JP;
Kazuyoshi Kawano, Hashima-gun, JP;
Tomoya Takahashi, Ibi-gun, JP;
Toshikazu Sana, Kakamigahara, JP;
Akihito Sakai, Gifu, JP;
Akira Murai, Minokamo, JP;
Yasuhiro Takenaka, Anpachi-gun, JP;
Kazuyoshi Kawano, Hashima-gun, JP;
Tomoya Takahashi, Ibi-gun, JP;
KAWASAKI JUKOGYO KABUSHIKI KAISHA, Hyogo, JP;
Abstract
A mold () according to the present invention is a mold for molding a surface of a laminate () when curing the laminate () obtained by laminating prepreg (). The mold () has a planar plate shape and elastically deforms from the planar plate shape into a shape corresponding to a shape of the laminate (), thereby being capable of coming tight into contact with the laminate (). Thereby, a mold which is easy to handle can be provided.