The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Sep. 30, 2015
Computer-implemented simulation method and non-transitory computer medium for use in molding process
Coretech System Co., Ltd., Hsinchu County, TW;
Tung Huan Su, Hsinchu County, TW;
Hsien Sen Chiu, Hsinchu County, TW;
Rong Yeu Chang, Hsinchu County, TW;
Chia Hsiang Hsu, Hsinchu County, TW;
Ching Chang Chien, Hsinchu County, TW;
Chih Chung Hsu, Hsinch County, TW;
CORETECH SYSTEM CO., LTD., Hsinchu County, TW;
Abstract
A molding method includes the steps of specifying a simulating domain having a resin part and a mold part, wherein the simulating domain corresponds to a genuine domain on a molding machine; setting an initial resin temperature of the resin part and an initial mold temperature of the mold part; performing a transient state analysis to calculate a plurality of temperature distributions at different times between the resin part and the mold part; calculating at least one heat transfer coefficient between the resin part and the mold part taking into consideration the plurality of temperature distributions at different times; simulating the molding process of a molding resin that is injected into the simulating domain by using the at least one heat transfer coefficient to generate a plurality of molding conditions; and performing the molding process by using the plurality of molding conditions to the genuine domain on the molding machine.