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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9409247 B1

PDFFull Text
Date of Patent:
Aug. 09, 2016

Filed:

Aug. 15, 2014

Joining method, method for producing electronic device and electronic part

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-Fu, JP;

Inventors:

Kosuke Nakano, Nagaokakyo, JP;

Hidekiyo Takaoka, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); B23K 35/26 (2006.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); H01L 21/52 (2006.01); C22C 9/04 (2006.01); B23K 35/02 (2006.01); B23K 1/008 (2006.01); H01R 4/02 (2006.01); H05K 13/04 (2006.01); B23K 35/30 (2006.01); B23K 35/22 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/008 (2013.01); B23K 1/19 (2013.01); B23K 35/025 (2013.01); B23K 35/0216 (2013.01); B23K 35/0233 (2013.01); B23K 35/0244 (2013.01); B23K 35/0266 (2013.01); B23K 35/222 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 9/00 (2013.01); C22C 9/01 (2013.01); C22C 9/04 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H01L 21/52 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01R 4/02 (2013.01); H05K 13/0465 (2013.01); B23K 2201/42 (2013.01); H01L 24/27 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/01322 (2013.01); H05K 3/3436 (2013.01); H05K 3/3463 (2013.01);
Abstract

In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.

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