The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Mar. 26, 2012
Joel W. Burdick, Pasadena, CA (US);
Yu-chong Tai, Pasadena, CA (US);
John F. Naber, Goshen, KY (US);
Robert S. Keynton, Louisville, KY (US);
Victor Reggie Edgerton, Los Angeles, CA (US);
Roland R. Roy, Playa Vista, CA (US);
Yury Gerasimenko, Los Angeles, CA (US);
Susan J. Harkema, Louisville, KY (US);
Jonathan Hodes, Louisville, KY (US);
Claudia A. Angeli, Louisville, CA (US);
Mandheerej S. Nandra, Pasadena, CA (US);
Thomas Anthony Desautels, Pasadena, CA (US);
Steven L. Upchurch, Louisville, KY (US);
Douglas J. Jackson, New Albany, IN (US);
Nicholas A. Terrafranca, Laguna Niguel, CA (US);
Yangshen Chen, Louisville, KY (US);
Joel W. Burdick, Pasadena, CA (US);
Yu-Chong Tai, Pasadena, CA (US);
John F. Naber, Goshen, KY (US);
Robert S. Keynton, Louisville, KY (US);
Victor Reggie Edgerton, Los Angeles, CA (US);
Roland R. Roy, Playa Vista, CA (US);
Yury Gerasimenko, Los Angeles, CA (US);
Susan J. Harkema, Louisville, KY (US);
Jonathan Hodes, Louisville, KY (US);
Claudia A. Angeli, Louisville, CA (US);
Mandheerej S. Nandra, Pasadena, CA (US);
Thomas Anthony Desautels, Pasadena, CA (US);
Steven L. Upchurch, Louisville, KY (US);
Douglas J. Jackson, New Albany, IN (US);
Nicholas A. Terrafranca, Laguna Niguel, CA (US);
Yangshen Chen, Louisville, KY (US);
California Institute of Technology, Pasadena, CA (US);
University of Louisville Research Foundation, Inc., Louisville, KY (US);
The Regents of the University of California, Oakland, CA (US);
Abstract
Described are devices including stimulation assemblies connectable to a plurality of electrodes. The plurality of electrodes can be configured to connect to a spinal cord at a location below a lesion of the spinal cord. The stimulation assembly can be configured to deliver stimulation to selected ones of the plurality of electrodes when the stimulation assembly is connected to the plurality of electrodes when located below the lesion of the spinal cord. Methods of using the devices are also described.