The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Dec. 02, 2013
Eberhard Haiss, Jungingen, DE;
Martin Rojahn, Tuebingen, DE;
Matthias Taglieber, Tuebingen, DE;
Thomas Schrimpf, Reutlingen, DE;
Matthias Ludwig, Moessingen, DE;
Andreas Blum, Reutlingen, DE;
Eberhard Haiss, Jungingen, DE;
Martin Rojahn, Tuebingen, DE;
Matthias Taglieber, Tuebingen, DE;
Thomas Schrimpf, Reutlingen, DE;
Matthias Ludwig, Moessingen, DE;
Andreas Blum, Reutlingen, DE;
ROBERT BOSCH GMBH, Stuttgart, DE;
Abstract
An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.