The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

May. 01, 2015
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Shinsuke Yano, Nagoya, JP;

Makoto Tani, Inazawa, JP;

Hirokazu Nakanishi, Kakamigahara, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H05K 1/053 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/062 (2013.01);
Abstract

A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.


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