The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Dec. 09, 2013
Applicant:

Arkansas Power Electronics International, Inc., Fayetteville, AR (US);

Inventors:

Brandon Passmore, Fayetteville, AR (US);

Zach Cole, Fayetteville, AR (US);

Bret Whitaker, Fayetteville, AR (US);

Adam Barkley, Springdale, AR (US);

Ty McNutt, Farmington, AR (US);

Alexander Lostetter, Fayetteville, AR (US);

Assignee:

Cree Fayetteville, Inc., Fayetteville, AR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/04 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H03K 17/04 (2013.01); H05K 1/0243 (2013.01); H05K 1/144 (2013.01);
Abstract

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.


Find Patent Forward Citations

Loading…