The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Jul. 20, 2011
Applicants:
Vassili Kireev, Sunnyvale, CA (US);
James Karp, Saratoga, CA (US);
Inventors:
Vassili Kireev, Sunnyvale, CA (US);
James Karp, Saratoga, CA (US);
Assignee:
XILINX, INC., San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/16 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/147 (2013.01); H01L 23/49827 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 23/481 (2013.01); H01L 24/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract
An inductor for an integrated circuit can include a first turn comprising a first through silicon via (TSV) coupled to a second TSV. The inductor can include a third TSV coupled to the second TSV.