The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Oct. 27, 2011
Applicants:
Khalil Hosseini, Weihmichl, DE;
Frank Kahlmann, Neubiberg, DE;
Inventors:
Khalil Hosseini, Weihmichl, DE;
Frank Kahlmann, Neubiberg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 29/40 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 23/291 (2013.01); H01L 23/3185 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 29/402 (2013.01); H01L 23/552 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/034 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/0556 (2013.01); H01L 2224/0612 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01);
Abstract
An embodiment electronic device comprises a semiconductor chip including a first main face, a second main face and side faces each connecting the first main face to the second main face. A metal layer is disposed above the second main face and the side faces, the metal layer including a porous structure.