The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Dec. 10, 2014
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventor:
Nan-Jang Chen, Hsinchu, TW;
Assignee:
MEDIATEK INC., Science-Based Industrial Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/49517 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01);
Abstract
A semiconductor package includes a die pad, wherein a semiconductor die is mounted on the die pad; a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad; at least one connecting bar connecting with the die pad; and a power bar disposed on one side of the connecting bar, wherein the power bar is integrally connected to the power lead. A capacitor is mounted between the power bar and the connecting bar.