The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Feb. 26, 2013
Shimadzu Research Laboratory (Shanghai) Co. Ltd., Shanghai, CN;
Gongyu Jiang, Shanghai, CN;
Wenjian Sun, Shanghai, CN;
SHIMADZU RESEARCH LABORATORY (SHANGHAI) CO. LTD., Shanghai, CN;
Abstract
A linear ion beam bonding apparatus and an array structure thereof, comprising a pair of primary radiofrequency electrodes (and) extending along the axial direction and oppositely arranged on two sides of the central axis of the linear ion beam bonding apparatus. Section patterns on different section planes of each of the primary radiofrequency electrodes (and) and perpendicular to the central axis are all kept symmetric via a primary symmetric plane () of the central axis. Radiofrequency voltages attached to the primary radiofrequency electrodes (and) are of identical phases. An ion extraction groove () is arranged on at least one of the primary radiofrequency electrodes (and), while at least one pair of auxiliary electrodes (and) are arranged on two sides of the pair of primary radiofrequency electrodes (and). The auxiliary electrodes (and) are arranged in duality to the primary symmetric plane (). At least one of the auxiliary electrodes (and) is provided with a finite number of symmetric planes (), while a minimal angle greater than 0 degrees and less than 90 degrees is provided between each symmetric plane () and the symmetric plane () of the primary radiofrequency electrodes (and). By means of this, a quadrupole field component of an ion beam bonding radiofrequency electric field within the ion beam bonding apparatus is strengthened.