The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Apr. 01, 2011
Akinobu Isurugi, Osaka, JP;
Kiyoshi Minoura, Osaka, JP;
Hidekazu Hayashi, Osaka, JP;
Kenichiro Nakamatsu, Osaka, JP;
Akinobu Isurugi, Osaka, JP;
Kiyoshi Minoura, Osaka, JP;
Hidekazu Hayashi, Osaka, JP;
Kenichiro Nakamatsu, Osaka, JP;
SHARP KABUSHIKI KAISHA, Osaka, JP;
Abstract
A mold manufacturing method of an embodiment of the present invention includes the steps of: (a) providing a mold base; (b) partially anodizing the aluminum layer to form a porous alumina layer, the porous alumina layer having a porous layer which defines a plurality of minute recessed portions and a barrier layer which is provided at a bottom of each of the plurality of minute recessed portions; and (c) after step (b), performing etching, thereby enlarging the plurality of minute recessed portions of the porous alumina layer, wherein in step (c) the etching is performed such that an average depth of the plurality of minute recessed portions increases but does not exceed a 1/7 of an average thickness of the barrier layer before the etching.